ChipX Home

One physical-layer architecture.
Sequenced products.

CHIPX develops finished semiconductor products designed to help AI infrastructure turn more of a fixed power envelope into useful compute.

CHIPX Connect Image

What we build

Products designed
as one system

Power is the first commercial entry point. Photonics follows. Memory, packaging and thermal integration deepen the platform as each preceding layer proves the route to deployment.

  • 800V SiC Power Products

    The first commercial entry point. CHIPX’s 800V SiC architecture is designed around AI-system power requirements to reduce conversion losses between the grid and the accelerator.

    800V SiC Power Products

  • 3.2 Tb/s Optical Transceiver

    The next commercial deployment. CHIPX is industrialising a DSP-less optical transceiver for high-bandwidth data movement within and between AI servers and racks.

    3.2 Tb/s Optical Transceiver

  • Memory AI Accelerator

    The later platform roadmap integrates memory architecture, advanced packaging and thermal interfaces closer to the accelerator. This layer remains gated by commercial milestones in power and photonics.

    Memory AI Accelerator

How we do it

From architecture
to finished product

CHIPX owns the reference architecture, product design, specification, qualification and customer relationship. Qualified partners fabricate, package, assemble, test and fulfil.

CHIPX architecture connecting product design, manufacturing and AI-system integration
One architecture across the physical stack

Power, photonics, memory, packaging and thermal integration are designed against CHIPX Connect. The aim is to improve the system around AI compute rather than optimise each component in isolation.

Who we serve

AI infrastructure
customers and partners

CHIPX works with the organisations that specify, integrate and operate AI infrastructure—from AI factory and data-centre operators to OEMs, ODMs and system integrators.

AI Factory Operators - CHIPX

AI Factory Operators

Turn a fixed power envelope into more useful AI compute by improving the physical system around the accelerator.

Data Centre Operators - CHIPX

Data Centre Operators

Address power conversion, data movement and thermal constraints across server and rack infrastructure.

OEMs - CHIPX

OEMs

Integrate finished CHIPX semiconductor products and modules into AI servers, racks and infrastructure.

ODMs - CHIPX

ODMs

Translate reference designs into manufacturable systems aligned with customer specifications and qualification requirements.

System Integrators - CHIPX

System Integrators

Coordinate products across the physical AI stack and deliver them into operating infrastructure.