Advanced Semiconductor
Platforms, Built to Scale
CHIPX offers secure, accessible integrated semiconductor technology that improves efficiency, cuts emissions, and drives profitability.
What we build
SemiconductorPlatforms in Production
High-performance semiconductor platforms spanning power, photonics, and thermal intelligence—engineered for durability, efficiency, and scale.
GaN/SiC Wafers (8” & 12”)
Built on more than 20 years of proprietary R&D, the Gallium Nitride (GaN) on Silicon Carbide (SiC) wafer platform delivers superior durability, strong foundry compatibility, and higher yield with lower waste than incumbent solutions. The wafers serve as foundation for advanced power devices and next-generation packaging technologies.
High-Voltage Chips (800V & 1200V)
Designed for hyperscale data centers and EV charging infrastructure, these GaN/SiC high-voltage (HV) chips enable stable, high-throughput power delivery under extreme electrical loads. The architecture operates with significantly lower waste heat, reducing thermal stress, energy spikes, and downtime as power density continues to rise. High Voltage chips are a core component of the leading “Hopper” GPU, Blackwell, Vera Rubin, MI350x and MI450x architecture.
Silicon Photonics Chips
Our silicon photonics solutions enable multi-terabit-per-second optical data transfer, supporting 1.6 Tb/s today with higher-bandwidth Co-Packaged Optics (CPO) architectures rolling out and beyond on the pipeline. High-speed, low-latency communication between processors and memory is achieved while dramatically reducing power consumption and heat compared to traditional electrical interconnects. Silicon Photonics are a core component of the leading “Hopper” GPU, the Blackwell, Vera Rubin, MI350X, MI325X, MI300X, MI300A & MI250X. architectures.
12 Inch Silicon Carbide Interposers
The 12-inch SiC interposer enables next-generation DRAM, SRAM, and NAND memory to operate at higher power densities and lower temperatures than silicon interposers. With dramatically higher thermal conductivity (100X), the solution improves heat dissipation, reliability, and sustained performance in advanced memory stacks and AI systems.
How we do it
From Breakthroughto High Volume
CHIPX combines proprietary materials science with disciplined, agile engineering. Strategic collaboration with tier one foundries enables a seamless transition from laboratory innovation to high volume manufacturing.
These technologies form a vertically integrated platform delivering compounding efficiency gains across materials, packaging, and system operation. This provides complete, scalable solutions for hyperscalers, OEMs, and infrastructure operators. Environmental responsibility aligned with scalability and profitability.
Who we serve
End-Market ApplicationsCHIPX technologies are deployed where compute demand, performance requirements, and infrastructure resilience are most critical. Across automotive systems, AI data centers, high speed networking and communications, national security infrastructure, and advanced compute and graphics platforms, CHIPX delivers integrated semiconductor solutions that improve efficiency, strengthen reliability, and enable scalable performance across the most demanding end market applications.
Automotive
AI Data Centers
Networking and Communications
National Security
