Explore the latest news, announcements, and insights from CHIPX - covering breakthroughs, collaborations, and contributions to advanced semiconductor manufacturing.
At World Future Energy Summit (WFES) 2026, hosted by Masdar (Abu Dhabi Future Energy Company) as part of Abu Dhabi Sustainability Week. Chinmoy Baruah, Founder & CEO of CHIPX, joined two WFES panels examining how AI can scale without driving unsustainable energy demand.
Chinmoy Baruah met with Ajay Sharma, the British High Commissioner to Malaysia, as part of our ongoing engagement with leaders shaping the future of technology, industry, and economic cooperation across the region.
CHIPX is advancing Malaysia into high-end semiconductor fabrication with a new 200 mm fab focused on GaN-on-SiC and silicon photonics for AI and next-gen compute.
Chinmoy Baruah examines how AI’s growth depends on PFAS “forever chemicals,” exposing their environmental costs and the need for safer alternatives.
CHIPX is set to build Malaysia’s first state-of-the-art 8-inch GaN-on-SiC wafer fabrication facility, marking a major step into front-end semiconductor manufacturing in the ASEAN region.
CHIPX is planning to build an 8-inch (200 mm) GaN-on-SiC wafer fabrication facility in Malaysia, marking one of the first front-end semiconductor fabs in the ASEAN region to support AI, photonics, and high-performance computing applications.
CHIPX has announced its first 8-inch GaN-on-SiC semiconductor fabrication facility in ASEAN, to be built in Malaysia with advanced industrial automation to support high-performance and AI-oriented chip production.
CHIPX will establish a state-of-the-art 8-inch wafer fabrication facility in Malaysia, introducing advanced GaN/SiC manufacturing and accelerating the region’s entry into front-end semiconductor production.
CHIPX will build an advanced semiconductor fabrication facility in Malaysia, focusing on 200 mm wafer production for GaN and compound semiconductor technologies to support AI, photonics, and power applications.
CHIPX is planning the ASEAN region’s first 200 mm wafer fabrication facility in Malaysia, focusing on GaN-on-SiC and advanced semiconductor technologies to support AI and high-performance applications.
CHIPX is planning Malaysia’s first 8-inch GaN-on-SiC wafer fabrication facility, advancing front-end semiconductor manufacturing in the ASEAN region and supporting next-generation AI, photonics, and high-performance compute technologies.
CHIPX is advancing Malaysia’s semiconductor sector with plans for an 8-inch (200 mm) GaN-on-SiC wafer fab, boosting the region’s front-end manufacturing for AI and advanced technologies.
CHIPX is advancing Malaysia’s semiconductor manufacturing footprint with a new state-of-the-art 8-inch wafer fab, bringing front-end GaN/SiC production and photonics capabilities to the ASEAN region.
CHIPX is set to build the ASEAN region’s first 200 mm front-end semiconductor wafer fab in Malaysia, focusing on GaN-on-SiC and advanced materials to support AI, photonics, and high-performance applications.
CHIPX is expanding Malaysia’s semiconductor manufacturing footprint with plans for a state-of-the-art 8-inch wafer fab, introducing advanced GaN/SiC front-end production to the ASEAN region and boosting capabilities for AI, photonics, and high-performance compute technologies.
CHIPX is advancing Malaysia’s semiconductor manufacturing footprint with plans for a state-of-the-art 8-inch (200 mm) GaN/SiC wafer fabrication facility, the first of its kind in ASEAN, to boost front-end production and support AI, photonics and high-performance compute technologies.
CHIPX is advancing Malaysia’s semiconductor manufacturing footprint with a new 8-inch (200 mm) front-end wafer fab focused on GaN/SiC technologies, enhancing regional capabilities for AI and advanced applications.
CHIPX is boosting Malaysia’s semiconductor ecosystem with a new 8-inch (200 mm) front-end wafer fab for advanced GaN/SiC production, strengthening regional capabilities for AI and high-performance technologies.
CHIPX is expanding Malaysia’s semiconductor capabilities with a new front-end 200 mm wafer fab, bringing advanced GaN/SiC manufacturing to the ASEAN region to support AI, photonics, and high-performance technologies.
CHIPX is advancing Malaysia’s semiconductor manufacturing footprint with plans for a new 8-inch (200 mm) GaN/SiC front-end wafer fabrication facility, strengthening the ASEAN region’s capabilities for AI, photonics, and high-performance technologies.
Podcast - Mission Matters Innovation with Adam Torres - Host Adam Torres interviews Chinmoy Baruah. Chinmoy explains how his company is tackling AI efficiency at the semiconductor level.
Industry 5.0’s evolution from Industry 4.0 hinges on sustainable, distributed compute to support AI, human-machine collaboration, and decentralized processing while balancing energy, materials, and environmental demands.
Meeting with Nurhisham Hussein at the Prime Minister’s Office (Malaysia) underscored strong alignment between CHIPX Global’s mission and Malaysia’s National Semiconductor Strategy to advance sovereign, sustainable semiconductor and photonics innovation.
A visit to CSA Catapult highlighted how collaboration and world-class facilities are advancing the UK’s compound semiconductor ambitions, reinforcing CHIPX Global’s commitment to sovereign, resilient ecosystems across regions.
CHIPX Founder Chinmoy Baruah explores how wide-bandgap and compound semiconductor design is key to meeting rising energy and compute demands — driving performance, efficiency, and sustainability beyond traditional silicon in power and AI applications.
Patrick Molloy and Alicia Eastman sit down with Chinmoy, the Founder and CEO of CHIPX™ Global. He describes how CHIPX™ is disrupting semiconductor design, manufacturing and usage to reduce energy requirements, eliminate emissions, and lower costs.
CHIPX Global has officially moved in team members to our new office space at London GreenCity! Just took a swing by to celebrate the collaboration!
At CHIPX Global, we’re building a decentralized, resilient semiconductor ecosystem— from GaN/SiC power ICs and silicon photonics to mission-grade systems for AI, mobility, defense, and aerospace.
We are proud to share an important milestone in our journey to decentralize, decarbonize, and redefine the future of semiconductors💥
Alicia Eastman was delighted to attend the Multilateral Industrial Policy Forum (MIPF) held in Riyadh. The event was hosted by the KSA Ministry of Industry and Mineral Resources in cooperation with UNIDO.