Revolutionising Semiconductor Chip Production
CHIPX is building decentralized, resilient semiconductor infrastructure designed for tomorrow’s intelligence. From high-conductivity substrates to mission-grade systems, we engineer sovereignty into silicon — and beyond.
What we're building
At CHIPX, we’re reinventing how and where semiconductors are made. Our vertically integrated platform combines advanced materials, high-voltage ICs, and system-level design to deliver resilient, performance-driven technologies.
CHIPX Connect™ accelerates semiconductor innovation across power, photonics, and sensing. From ceramic substrates to GaN/SiC ICs, we enable mission-grade systems for AI, defence, and mobility—bridging the gap between R&D and real-world deployment.
Technology Stack & Integration Model
Our Technologies
- AlN Ceramic Substrates for heat-intensive systems
- GaN/SiC Power ICs (600V / 800V) for high-efficiency power
- Silicon Photonics & Co-Packaged Optics modules
- Thermal Imaging Sensors for UAVs & IIoT solutions
- Battery Monitoring Systems for energy safety & control
Our Integration Model
Foundry-integrated substrate and packaging solutions
WIND™ thermal architecture engineered for reliability
CRM-mode GaN PFC with 99.5% peak efficiency
Edge-ready thermal imaging for UAVs & critical infrastructure
Modular architecture for rapid deployment across sectors
WIND™ Architecture
Thermal Resilience by Design
Traditional substrates can't keep up with modern thermal demands. CHIPX Connect™ substrates, powered by WIND Architecture, use high-conductivity AlN cores, laser-milled directional sinks, and embedded MEMS sensors for real-time thermal control and long-term reliability.
Whether enabling AI server uptime, UAV resilience, or EV charging efficiency — we engineer performance at the material level.


CHIPX is collaborating with leading foundries and partners to embed our designs into global production pipelines. With R&D hubs and fabrication sites in Wales, Singapore, Malaysia, and Taiwan, we’re building a secure, scalable supply chain engineered for speed and resilience.
This infrastructure puts us on track to power next-gen AI servers, defence systems, and EVs, bringing high-performance technologies to market, fast.
Leadership Team
Executive & Board Leadership

Chinmoy Baruah
Founder & CEO
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Alicia Eastman
Co-Founder & Non-Executive Director
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Irina Gorbounova
Co-Founder & Non-Executive Director
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Errol Finkelstein
Co-Founder & COO
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David Kielty
Board Director
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Joe Liu
Director of Integration & Commercialization
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Priya Mohan
CFO
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Jan-Eric Müller
Co-Founder & Non-Executive Director
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Eddie Yao
Co-Founder & CTO
Read more >Senior Advisors

Sean Lien
Senior Asia Strategy Advisor
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Dr. Chris Cooper
Senior Data Governance, Compliance and Infrastructure Advisor
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Gage McAfee
Senior Asia Pacific Growth Advisor
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Zheng Zheng
Senior Financial Advisor for Asia and Europe
Read more >Strategic Advisors

Illana Adamson
ESG and Water
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Andrew Alexander
Global Partnerships and Finance (North America)
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Cinzia Casiraghi
Materials Science and Engineering
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Lars Hansen
Renewable Energy Strategic Advisor
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Patrick Misiewicz
Defence, Security & Compliance (Europe)
Read more >Contact
CHIPX Wales Limited
Alexandra Gate Business Centre Cardiff, Wales, CF24 2SAinfo@chipxglobal.com