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Revolutionising Semiconductor Chip Production

CHIPX is building decentralized, resilient semiconductor infrastructure designed for tomorrow’s intelligence. From high-conductivity substrates to mission-grade systems, we engineer sovereignty into silicon — and beyond.

What we're building

At CHIPX, we’re reinventing how and where semiconductors are made. Our vertically integrated platform combines advanced materials, high-voltage ICs, and system-level design to deliver resilient, performance-driven technologies.

CHIPX Connect™ accelerates semiconductor innovation across power, photonics, and sensing. From ceramic substrates to GaN/SiC ICs, we enable mission-grade systems for AI, defence, and mobility—bridging the gap between R&D and real-world deployment.

Technology Stack & Integration Model

Our Technologies

  • AlN Ceramic Substrates for heat-intensive systems
  • GaN/SiC Power ICs (600V / 800V) for high-efficiency power
  • Silicon Photonics & Co-Packaged Optics modules
  • Thermal Imaging Sensors for UAVs & IIoT solutions
  • Battery Monitoring Systems for energy safety & control

Our Integration Model

  • Substrate Foundry-integrated substrate and packaging solutions
  • WIND architecture WIND™ thermal architecture engineered for reliability
  • GaN PFC CRM-mode GaN PFC with 99.5% peak efficiency
  • Thermal imaging Edge-ready thermal imaging for UAVs & critical infrastructure
  • Modular design Modular architecture for rapid deployment across sectors

WIND™ Architecture
Thermal Resilience by Design

Traditional substrates can't keep up with modern thermal demands. CHIPX Connect™ substrates, powered by WIND Architecture, use high-conductivity AlN cores, laser-milled directional sinks, and embedded MEMS sensors for real-time thermal control and long-term reliability.

Whether enabling AI server uptime, UAV resilience, or EV charging efficiency — we engineer performance at the material level.

Transforming Semiconductor Manufacturing
Transforming Semiconductor Manufacturing

CHIPX is collaborating with leading foundries and partners to embed our designs into global production pipelines. With R&D hubs and fabrication sites in Wales, Singapore, Malaysia, and Taiwan, we’re building a secure, scalable supply chain engineered for speed and resilience.

This infrastructure puts us on track to power next-gen AI servers, defence systems, and EVs, bringing high-performance technologies to market, fast.

Leadership Team

Executive & Board Leadership

Chinmoy Baruah

Chinmoy Baruah

Founder & CEO
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Alicia Eastman

Alicia Eastman

Co-Founder & Non-Executive Director
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Irina Gorbounova

Irina Gorbounova

Co-Founder & Non-Executive Director
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Errol Finkelstein

Errol Finkelstein

Co-Founder & COO
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David Kielty

David Kielty

Board Director
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Joe Liu

Joe Liu

Director of Integration & Commercialization
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Priya Mohan

Priya Mohan

CFO
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Jan-Eric Müller

Jan-Eric Müller

Co-Founder & Non-Executive Director
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Eddie Yao

Eddie Yao

Co-Founder & CTO
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Senior Advisors

Sean Lien

Sean Lien

Senior Asia Strategy Advisor
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Chris Cooper

Dr. Chris Cooper

Senior Data Governance, Compliance and Infrastructure Advisor
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Gage McAfee

Gage McAfee

Senior Asia Pacific Growth Advisor
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Zheng Zheng

Zheng Zheng

Senior Financial Advisor for Asia and Europe
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Strategic Advisors

Illana Adamson

Illana Adamson

ESG and Water
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Andrew Alexander

Andrew Alexander

Global Partnerships and Finance (North America)
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Cinzia Casiraghi

Cinzia Casiraghi

Materials Science and Engineering
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Lars Hansen

Lars Hansen

Renewable Energy Strategic Advisor
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Patrick Misiewicz

Patrick Misiewicz

Defence, Security & Compliance (Europe)
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Contact

  • LocationCHIPX Wales Limited
    Alexandra Gate Business Centre Cardiff, Wales, CF24 2SA
  • Emailinfo@chipxglobal.com
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